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High Thermal Performance Electronic Package Utilizing a Combination of Heat Spreader Members

IP.com Disclosure Number: IPCOM000109393D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Anschel, M: AUTHOR

Abstract

Enhanced thermal management in electronic packaging is a key constraint that system designers encounter. As power dissipation requirements increase from today's 20 watts/cm2 to 100 watts/cm2 in the future, the thermal control of junction temperatures and temperature gradients through better thermal interface management is required for high reliability and performance. The thermal enhancement of high-power generating chips requires conducting the heat away from the chip to the environment, air or water. The thermal resistance from the chip to the ultimate heat sink needs to be small in order to achieve the objective of minimizing the temperature rise. This results in a very low internal thermal resistances, and consequently high levels of power can be dissipated.

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High Thermal Performance Electronic Package Utilizing a Combination of Heat Spreader Members

       Enhanced thermal management in electronic packaging is a
key constraint that system designers encounter.  As power dissipation
requirements increase from today's 20 watts/cm2 to 100 watts/cm2 in
the future, the thermal control of junction temperatures and
temperature gradients through better thermal interface management is
required for high reliability and performance.  The thermal
enhancement of high-power generating chips requires conducting the
heat away from the chip to the environment, air or water.  The
thermal resistance from the chip to the ultimate heat sink needs to
be small in order to achieve the objective of minimizing the
temperature rise.  This results in a very low internal thermal
resistances, and consequently high levels of power can be dissipated.

      Disclosed is a high thermal performance package for either tape
automated bonding (TAB) carriers, DECAL carriers, lead frame
carriers, wire-bonded chips or direct attached chips (DCA).  The
configuration consists of a single- or multi-chip module with the
chips attached to a thick heat spreader made of a material that is of
high thermal conductivity, yet closely matching the chip in its
coefficient of thermal expansion (CTE).  This could be either ceramic
or copper invar copper.  The interface between the chip and thick
spreader is a thin diamond film spreader that has very high thermal
conductivity.  The thick spreader is then attached to a heat sink
using a thicker pliable interface to accommodate the thermal mismatch
b...