Browse Prior Art Database

Vacuum Bond Fixture

IP.com Disclosure Number: IPCOM000109414D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Hill, DG: AUTHOR [+4]

Abstract

Disclosed is a device for applying uniform pressure when bonding printed wiring boards (PWBs) to heat sinks. The use of vacuum to pull down sheets of rubber onto PWB/heat sink assemblies is simplified through the use of support frames and a spacer.

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Vacuum Bond Fixture

       Disclosed is a device for applying uniform pressure when
bonding printed wiring boards (PWBs) to heat sinks.  The use of
vacuum to pull down sheets of rubber onto PWB/heat sink assemblies is
simplified through the use of support frames and a spacer.

      In the figure, frames 1 are attached to rubber sheets 3 to
support the rubber sheets and ensure a complete seal.  Spacer 2
provides clearance for PWB/heat sink assembly 5 and allows space for
a vacuum source connection 4.