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Cooled Lightweight High Power Conductor

IP.com Disclosure Number: IPCOM000109431D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

Burley, CU: AUTHOR [+3]

Abstract

Described is the design and implementation of a cooled lightweight high-power conductor. This design provides a means to conduct high-current requirements with a relative small conductor cross-section. This concept reduces major problems associated with stress and strain caused by the use of large amounts of copper for high current/power distribution systems. The conductor design can eliminate/minimize the need for special designs for thermal sinks, air-cooled fins, water-cooled devices, etc.

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Cooled Lightweight High Power Conductor

      Described is the design and implementation of a cooled
lightweight high-power conductor.  This design provides a means to
conduct high-current requirements with a relative small conductor
cross-section.  This concept reduces major problems associated with
stress and strain caused by the use of large amounts of copper for
high current/power distribution systems.  The conductor design can
eliminate/minimize the need for special designs for thermal sinks,
air-cooled fins, water-cooled devices, etc.

      The cooled lightweight high-power conductor represented in
Figure 1 shows a thermally enhanced conductive mechanism.  The copper
conductor utilizes Beryllium copper that has been hollowed out to
allow the passage of fluids or gases (1-5) to cool the chamber (2).
The outer surface and the chamber wall are both nickel plated to
prevent corrosion.  The gold dots (3) are attached to the outer
surface of the conductive chamber to interface with another
conductive surface.  The gold dots are used to provide a very low
contact resistance path for power distribution on large boards (5000+
Amps).

      The design in Figure 1 is capable of delivering or supporting
current requirements on the order of 1300 amperes.  The serial
chamber (2) allows for fluids/gases (1-5) to flow continuously
through the conductive mechanism.  This bus board distributor can be
welded into the main power distribution and coolant system.
Depen...