Browse Prior Art Database

Flux Immersion Soldering

IP.com Disclosure Number: IPCOM000109449D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR

Abstract

Flux Immersion Soldering Process offers uniform component heating, an oxide-reducing soldering environment, flux outgassing elimination and solid flux residue elimination.

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This is the abbreviated version, containing approximately 100% of the total text.

Flux Immersion Soldering

      Flux Immersion Soldering Process offers uniform component
heating, an oxide-reducing soldering environment, flux outgassing
elimination and solid flux residue elimination.

      Heating system (1) heats flux (2) to soldering temperature.
Components to be soldered (3) are immersed in flux (2) and rest on
shelf (4) until predeposited solder on components to be soldered (3)
reflows and solders components.  Heating system (1) is lowered via
electro-mechanical traversing system (5) until components to be
soldered (3) are not longer immersed in flux (2).  Valve (6) is
opened allowing quench flux (7) to quench the now soldered
components.

      Disclosed anonymously.