Browse Prior Art Database

High Density Hermetic Module Frame Design

IP.com Disclosure Number: IPCOM000109452D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 60K

Publishing Venue

IBM

Related People

Lake, JK: AUTHOR [+3]

Abstract

Disclosed herein is a design concept which permits the fabrication of the High Density Hermetic Module, a large hybrid circuit module frame capable of achieving hermetic seals at the cover and input/output (I/O) feed-thru's. The design supports the use of new, high performance metal matrix composite (MMC) materials, overcomes the machining problems associated with producing complex three-dimensional structures using the MMC's, and eliminates the reliability concerns associated with stresses due to mismatched coefficients of thermal expansion (CTE) at the seals.

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High Density Hermetic Module Frame Design

      Disclosed herein is a design concept which permits the
fabrication of the High Density Hermetic Module, a large hybrid
circuit module frame capable of achieving hermetic seals at the cover
and input/output (I/O) feed-thru's.  The design supports the use of
new, high performance metal matrix composite (MMC) materials,
overcomes the machining problems associated with producing complex
three-dimensional structures using the MMC's, and eliminates the
reliability concerns associated with stresses due to mismatched
coefficients of thermal expansion (CTE) at the seals.

      In this design, a base plate is fabricated from a one-piece MMC
sheet, (eg. BeO/Be, SiC/Al, etc.).  Open rings (2) are fabricated
from 0.025" thick sheets of an Iron/Nickel alloy (eg.  ASTM F-15)
selected to match the CTE of the base plate material.  These rings
are soldered or brazed to the front and back surfaces of the base
plate.  After hermeticity of the ring joints is verified, feed-thru
slots are machined into the rings, shown below.

      This approach to the construction of large hybrid chassis
relies on the use of standard fabrication techniques, thus avoiding
the development costs and risks associated with the fabrication of
one-piece MMC designs while benefitting from the attractive physical
properties of these materials, including high thermal conductivity,
low density and high strength and rigidity.  The selection of
Iron/Nickel...