Browse Prior Art Database

Cooling Device using Below Type Heat Pipe and Metal Cover

IP.com Disclosure Number: IPCOM000109455D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 61K

Publishing Venue

IBM

Related People

Kim, SJ: AUTHOR [+2]

Abstract

Printed circuit cards, such as those used in communication products, have a metal cover to eliminate the electro-magnetic interference. The disclosed idea is to take advantage of this metal cover to cool hot modules on the printed circuit card. Heat can be dissipated from the hot module to the metal cover using a cooling device. The cooling device between the module and the heat sink or metal cover should exhibit minimum thermal resistance and be resilient to allow for thermal expansion and large manufacturing variations.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 84% of the total text.

Cooling Device using Below Type Heat Pipe and Metal Cover

      Printed circuit cards, such as those used in communication
products, have a metal cover to eliminate the electro-magnetic
interference.  The disclosed idea is to take advantage of this metal
cover to cool hot modules on the printed circuit card.  Heat can be
dissipated from the hot module to the metal cover using a cooling
device.  The cooling device between the module and the heat sink or
metal cover should exhibit minimum thermal resistance and be
resilient to allow for thermal expansion and large manufacturing
variations.

      To meet these requirements, bellow-type heat pipe can be used
as shown in Figure 1.  The device operates like a conventional heat
pipe.  That is, heat is transferred from the hot module (1) to the
evaporator (2) section of the heat pipe, which causes the working
fluid to evaporate and flow to the condenser (3) end of the heat
pipe.  By dissipating heat to the metal cover (4) or heat sink, the
working fluid condenses at the upper end and returns back to the
lower end by capillarity through the wick.

      The attractive feature of this device is that the external
thermal resistance can be reduced far more than an individual heat
sink attached on the heat dissipating module can achieve.  This is
possible because the surface area for convective heat transfer is
increased significantly without temperature rise.  The advantage over
commercially available liquid heat p...