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Thin Film Circuit Line Repair using a Laser

IP.com Disclosure Number: IPCOM000109462D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Donelon, JJ: AUTHOR [+2]

Abstract

At least a 250 mesh Au-Cu composition (40/60%) was mixed with a suitable binder and applied across an open gap in a broken Cu line. The line gap was bridged by the metallic particles held by the binder. The binder caused local sticking to the open line ends. A projected image was focused on an area slightly straddling and between the line ends. This area was subjected to one laser pulse, e.g., an excimer laser at 248 nm and fluence 7 J/cm2. The laser radiation caused local melting of the broken line ends and melting of the material bridging the open segment.

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Thin Film Circuit Line Repair using a Laser

      At least a 250 mesh Au-Cu composition (40/60%) was mixed with a
suitable binder and applied across an open gap in a broken Cu line.
The line gap was bridged by the metallic particles held by the
binder.  The binder caused local sticking to the open line ends.  A
projected image was focused on an area slightly straddling and
between the line ends.  This area was subjected to one laser pulse,
e.g., an excimer laser at 248 nm and fluence 7 J/cm2.  The laser
radiation caused local melting of the broken line ends and melting of
the material bridging the open segment.

      Disclosed anonymously.