Browse Prior Art Database

Compact Hot Gas Thermode with Planarity Device

IP.com Disclosure Number: IPCOM000109466D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Cipolla, T: AUTHOR [+3]

Abstract

Disclosed is a hot gas thermode used to bond silicon chips to tape used today in surface mount technology. The chip has solder balls on it so they can be soldered to the tape leads. It is important to maintain co-planarity during bonding.

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Compact Hot Gas Thermode with Planarity Device

      Disclosed is a hot gas thermode used to bond silicon chips to
tape used today in surface mount technology.  The chip has solder
balls on it so they can be soldered to the tape leads.  It is
important to maintain co-planarity during bonding.

      The hot gas thermodes available to do this are often large and
inefficient.  Achieving co-planarity is usually a complex process.

      This solution (see fig.) is better in the following ways:  1-
The device has a built in co-planarity device.  2- It has an
efficient and compact heat exchanger that heats the nitrogen gas.  3-
The entire device measures 2" x 2" x 3.25".  4- A heat shield has
been added to allow the tool to run without excessive heating.  It
eliminates the need for a heat sink.

      Disclosed anonymously.