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Electroresistive Plastics as Ribbons for R2T2 Non-impact Thermal Printing

IP.com Disclosure Number: IPCOM000109467D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 79K

Publishing Venue

IBM

Related People

Angelopoulos, M: AUTHOR [+2]

Abstract

A structure and fabrication process are disclosed for print ribbons for non-impact thermal printing by resistive heating in the ribbon. This invention teaches an electrically resistive polymer instead of a carbon-loaded polymer. The electrically resistive layer is an electrically conjugated polymer polymerized inside a resin, such as polyaniline inside polycarbonate. This has potential for much easier fabrication and lower cost than prior ribbons which used a plastic resin with a dense filling of fine carbon.

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Electroresistive Plastics as Ribbons for R2T2 Non-impact Thermal Printing

      A structure and fabrication process are disclosed for print
ribbons for non-impact thermal printing by resistive heating in the
ribbon.  This invention teaches an electrically resistive polymer
instead of a carbon-loaded polymer.  The electrically resistive layer
is an electrically conjugated polymer polymerized inside a resin,
such as polyaniline inside polycarbonate.  This has potential for
much easier fabrication and lower cost than prior ribbons which used
a plastic resin with a dense filling of fine carbon.

      Resistive Ribbon Thermal Transfer R2T2 is a non-impact printing
technology which uses a ribbon which is electrically resistive on the
back face and has meltable ink on the front face.  A print head
touches the back of the ribbon.  This has fine electrodes which
electrically contact the ribbon.  When sufficient current passes
through the electrodes and resistive ribbon, the ribbon becomes hot.
The ink melts, then transfers to the paper where it freezes.
Subsequently, the ribbon and/or print head moves to put fresh ribbon
between the print head and paper.  During the typical life of a
printer system, the cumulative ribbon cost becomes significant.
Typical ribbon parameters are 400 ohms/square and about 14 microns
substrate thickness for a bulk conductivity of 1.8 S/cm.  Current
technologies use carbon-filled resins, such as polycarbonates and
polyimides. To attain th...