Browse Prior Art Database

Flex Bend Correction Clips for OLB

IP.com Disclosure Number: IPCOM000109472D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 40K

Publishing Venue

IBM

Related People

Bregman, MF: AUTHOR [+5]

Abstract

Flex interconnects consisting of fine metal lines on polyimide films are used to connect large substrates of various materials to a corresponding circuit board. A method of producing inner lead bonds consists of aligning, pinning, and hot gas reflow of a solder pad to a mating ILB lead. When this process is used for large substrates the thermal mismatches of the materials involved create a repetitive flex bowing that is permanent and at the same time inhibits the outer lead bonding process.

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Flex

Bend

Correction Clips for OLB

      Flex interconnects consisting of fine metal lines on polyimide
films are used to connect large substrates of various materials to a
corresponding circuit board.  A method of producing inner lead bonds
consists of aligning, pinning, and hot gas reflow of a solder pad to
a mating ILB lead.  When this process is used for large substrates
the thermal mismatches of the materials involved create a repetitive
flex bowing that is permanent and at the same time inhibits the outer
lead bonding process.

      This invention is a set of four clips that will interleave with
each other and attach themselves to existing standoff hardware.  The
design is such that a wedge-shaped tip in the center of each clip
will force the misaligned flex forward and down to meet the
corresponding solder pads.  The design of these clips is such that
hot gas or oven reflow during outer lead bonding is in no way
hindered.

      Disclosed anonymously.