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Browse Prior Art Database

Process for Enhancing Metal to Polyimide Adhesion

IP.com Disclosure Number: IPCOM000109477D
Original Publication Date: 1992-Aug-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 53K

Publishing Venue

IBM

Related People

Anschel, M: AUTHOR [+4]

Abstract

A process is described to improve the surface properties of commercially available polyimide films to provide improved adhesion of metal layers to the polymer surface. It is known that commercially available free-standing films of polyimide (e.g., Kapton" - DuPont) are fabricated using a chemical imidization process which results in the formation of transimide and isoimide along with the desired polyimide product. The presence of these side products results in lowering the polymer mechanical properties and thus lowers subsequent adhesion of metallization. It is desirable to improve the metal adhesion which is essential to reliable electronic packaging devices.

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Process for Enhancing Metal to Polyimide Adhesion

      A process is described to improve the surface properties of
commercially available polyimide films to provide improved adhesion
of metal layers to the polymer surface.  It is known that
commercially available free-standing films of polyimide (e.g.,
Kapton" - DuPont) are fabricated using a chemical imidization process
which results in the formation of transimide and isoimide along with
the desired polyimide product.  The presence of these side products
results in lowering the polymer mechanical properties and thus lowers
subsequent adhesion of metallization.  It is desirable to improve the
metal adhesion which is essential to reliable electronic packaging
devices.

      A surface treatment is described by which polyimide containing
transimide and isoimide is tranformed entirely to the polyimide form
to improve metal adhesion properties. This process involves treating
the polyimide film with an alkaline (hydroxide) solution to transform
a thin region of the polymer surface to the corresponding polyamic
acid state as is known in the literature.  The polymer now containing
a polyamic acid modified surface layer is then subjected to radio
frequency (100KHz-300MHz) or microwave (300MHz-300GHz) irradiation to
cause ring cyclization of the polyamic acid to the polyimide form.
Thus, the transimide and isoimide at the surface is converted to
polyimide which in turn yields improved mechanical and chemical
properties...