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Interposer Remove Tool

IP.com Disclosure Number: IPCOM000109491D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 3 page(s) / 113K

Publishing Venue

IBM

Related People

Elenius, P: AUTHOR [+2]

Abstract

An interposer is a new type of substrate of a thin film composition, approximately 20 millimeters square and 2 millimeters thick. The interposer has solder balls on one side for surface mount on a glass ceramic brick for an array of ten to 30 interposers. The other side of the interposer has C4 pads for semiconductor chips, capacitors and resistors.

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This is the abbreviated version, containing approximately 52% of the total text.

Interposer Remove Tool

       An interposer is a new type of substrate of a thin film
composition, approximately 20 millimeters square and 2 millimeters
thick.  The interposer has solder balls on one side for surface mount
on a glass ceramic brick for an array of ten to 30 interposers.  The
other side of the interposer has C4 pads for semiconductor chips,
capacitors and resistors.

      It has been found that an interposer is much more difficult to
remove from a substrate than a semiconductor chip.  With a typical
ultrasonic method of removal, the vibrations are absorbed into the
thin film composition of the interposer so that no C4 separations
occurred.  With a hot gas method of separation, the interposer was
totally destroyed,  damaging the chips and the glass ceramic
substrate.  Further, given the complexity of the interposer and
substrate, there is very little room available for error.

      An apparatus and method was developed to remove the interposers
from a substrate.  The removal could be a single interposer or a
multiple interposer removal.  Typical reasons that an interposer
would be removed include electrical or mechanical failure detected at
the module test cycle.  By removing the faulty interposer, the
substrate can be reworked.

      The operation of the tool can be better understood with
reference to Figs. 1 and 2.  The substrate 11 having the interposer
13 is placed into the interposer removal fixture and is locked in
place by means of the lock plate 15.  The interposer 13 to be removed
is selected and the cup lock assembly 17 is moved to the proper
interposer position.  The cup lock grippers 18, 19 are locked onto
the i...