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Browse Prior Art Database

Multiple Substrate Package

IP.com Disclosure Number: IPCOM000109586D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 2 page(s) / 101K

Publishing Venue

IBM

Related People

Horbach, G: AUTHOR [+4]

Abstract

This article describes a multiple substrate package which is suitable for automotive and industrial applications. Some of the extremely stringent requirements such a package has to meet, compared with those used in computers, are robustness and reliability, low-cost design, high density for multichip applications, small height to fit car body, easy to cool, hermetic sealing to prevent corrosion, and resistance to electromagnetic interference.

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This is the abbreviated version, containing approximately 52% of the total text.

Multiple Substrate Package

       This article describes a multiple substrate package which
is suitable for automotive and industrial applications.  Some of the
extremely stringent requirements such a package has to meet, compared
with those used in computers, are robustness and reliability,
low-cost design, high density for multichip applications, small
height to fit car body, easy to cool, hermetic sealing to prevent
corrosion, and resistance to electromagnetic interference.

      The novel package consists of a single metallic body with
several moldings embodying different substrates which each carry one
or more chips and other components.  Such a structure resembles that
of a board with different single and multichip modules.  The metallic
body is also provided with a variety of outer connectors.  The
different substrates and the inner connectors are linked by a single
(hard or flexible) board.

      The metallic body is produced by injection or extrusion
molding.  Its outer surface comprises a heat sink.  The fins of the
heat sink are designed for mechanical rigidity.  The inside is molded
in various ways and contains customized cavities embodying the
ceramic substrates carrying the chips.

      The moldings or cavities for the substrates are adaptable to
the different substrate sizes.  Their area and shape as well as the
depth of the cavities may vary.  Ceramic substrates are soldered to
the special side walls as shown to allow for the difference in
thermal expansion of the substrates and the metallic body.  The side
walls are flexible.  The outside wall carries a metallic cover plate,
with inner pillars acting as an additional support.  The cover plate
is screwed and sealed to the body.  The cavities are such that the
chips are located close to the body for perfect cooling.  The thermal
resistance between the chip and the environment is determined by the
distance between...