Browse Prior Art Database

Catalytic Activation of Polyimides for Electroless Plating

IP.com Disclosure Number: IPCOM000109598D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Franz, J: AUTHOR [+3]

Abstract

In thin-film packaging, copper wiring is achieved by etching a copper layer deposited on a polyimide dielectric by electroplating or electroless plating. Prior to depositing the copper, a seed layer of, say, Pd, has to be deposited on the polyimide surface.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Catalytic Activation of Polyimides for Electroless Plating

       In thin-film packaging, copper wiring is achieved by
etching a copper layer deposited on a polyimide dielectric by
electroplating or electroless plating.  Prior to depositing the
copper, a seed layer of, say, Pd, has to be deposited on the
polyimide surface.

      It has been found that selective ion milling of the polyimide
surface followed by immersion in an activating bath leads to a
catalytically selectively activated surface.  After activation, the
substrate is immersed in an electroless copper plating bath for a
time sufficient for obtaining an optimum copper film thickness on the
activated area.

      A mask of, say, ceramic, may be used to shield the part of the
polyimide surface which is not to be activated.

      In that way, the step of structuring a metal layer deposited on
the full polyimide surface is eliminated.