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Browse Prior Art Database

Quadflatpack Removal Nozzle

IP.com Disclosure Number: IPCOM000109600D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

This article describes a mechanical process to remove quadflatpack devices from electronic assemblies using a dynamic metal nozzle designed for use with a vapor phase rework station or other focused reflow equipment. This process allows removal of electrically functional components for reuse without damaging the lead form. Process Description:

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Quadflatpack Removal Nozzle

       This article describes a mechanical process to remove
quadflatpack devices from electronic assemblies using a dynamic metal
nozzle designed for use with a vapor phase rework station or other
focused reflow equipment.  This process allows removal of
electrically functional components for reuse without damaging the
lead form.
Process Description:

      Fig. 1 shows the positioning of nozzle 1 by reflow equipment 2
over the device 3 to be removed from board 4.

      Fig. 2 depicts the position of the magnet 5 which is attached
to chain 7 and controlled by thumbwheel 6.  Arrows 8 denote vapor
phase streamlines that condense and reflow solder joints 9.

      Fig. 3 shows that final configuration of the nozzle after
component removal.  Upon reflow of solder pads 9, the thumbwheel 6 is
rotated to pull the device 3 out of the solder.