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Control Scheme and Valve Design for Variable Flow Jet Impingement Cooling of Semiconductor Chips

IP.com Disclosure Number: IPCOM000109632D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 2 page(s) / 81K

Publishing Venue

IBM

Related People

Carbone, MC: AUTHOR [+2]

Abstract

Disclosed is a control methodology and valve design concept that enables automatic control of jet impingement chip cooling on a variety of 100 chip modules during test. Different powered chips are supplied the correct amount of coolant with the minimum amount of hardware. (Image Omitted)

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 72% of the total text.

Control Scheme and Valve Design for Variable Flow Jet Impingement Cooling of Semiconductor Chips

       Disclosed is a control methodology and valve design
concept that enables automatic control of jet impingement chip
cooling on a variety of 100 chip modules during test.  Different
powered chips are supplied the correct amount of coolant with the
minimum amount of hardware.

                            (Image Omitted)

      The degree of cooling that jet impingement delivers to chips
increases with volume flow rate of the liquid.  Current systems which
use jet impingement to cool the chips on multi-chip modules during
test supply the same flow of coolant to each chip.  Both lower and
upper limits exist for acceptable chip temperature, and providing the
same flow to each chip limits the capabilities of the system.
Coolant supplied to high-power chips is limited by the flow that
produces the lowest acceptable temperature in low-power chips.

      This invention provides a practical method to automatically
provide each differently powered chip with the correct volume flow
rate of liquid while retaining the flexibility to accept all module
types.  Central to the concept is the categorization of chips into
three classes: those requiring high, medium, and very low flow rates.
High and medium flows are used to cool high and medium power chips.
Low power chips often need no significant flow of coolant; boiling of
the liquid is sufficien...