Browse Prior Art Database

Card on Board System's Level Thermal Stress Device

IP.com Disclosure Number: IPCOM000109638D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Cooper, J: AUTHOR [+5]

Abstract

Disclosed is a device for thermal stressing card on board (COB) technology during functional testing of a complete system. Temperature on COB is elevated and closed-loop controlled without elevating temperature of surrounding hardware.

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Card on Board System's Level Thermal Stress Device

       Disclosed is a device for thermal stressing card on board
(COB) technology during functional testing of a complete system.
Temperature on COB is elevated and closed-loop controlled without
elevating temperature of surrounding hardware.

      In Fig. 1, stress device 1 is attached to COB gate 2, being a
sub-assembly of system frame 3.  Ambient air is pulled through stress
device by blower 4, heated, and forced over COB technology.  Heated
air is exhausted at the top of the sub-assembly.

      The stress device in Fig. 2 is controlled by an Omega CN9000*
temperature control unit 5.  Thermocouple 6 is attached to a blank
card in the COB gate 2, which senses air temperature and is fed back
to the CN9000.  Heating elements 7 are cycled on and off through
solid-state relays by the CN9000 logic output, which maintains a
closed-loop feedback stress system.
* Trademark of OMEGA Corp.