Browse Prior Art Database

Polymer Base Layer on Substrate for Adhesion Measurement

IP.com Disclosure Number: IPCOM000109704D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Lee, K: AUTHOR

Abstract

Disclosed is a method for an effective measure of peel strength between metal and polymer.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 74% of the total text.

Polymer Base Layer on Substrate for Adhesion Measurement

       Disclosed is a method for an effective measure of peel
strength between metal and polymer.

      Polyimides and metals are employed in microelectronic
packaging.  Adhesion involving the PI/metal and metal/PI (or PSPI) is
an important factor to the packaging technology.  One of the adhesion
tests is a peel test for which an adherend layer (metals) is coated
onto a silicon or quartz substrate.  Then an adherate layer (PI or
metals) is coated.  Peel strength is obtained by peeling the adherate
layer.  During the peel test the adherend layer is often delaminated
from the substrate, and thus all the efforts in preparing the samples
often end in failure.

      To prevent delamination of an adherend layer from the silicon
or quartz wafer during the peel test for the adherate to adherend
adhesion, a polymer layer (1-7 mm) was coated between the wafer and
the adherend layer.  Since polymer to wafer and adherend to polymer
adhesion is relatively strong, the peel strength for the adherate to
adherend adhesion can be measured.

      A layer (1-7 mm) of poly(biphenyldianhydride para-phenyl
diamine) (BPDA-PDA) was coated onto a quartz wafer with a silane
adhesion promoter and then cured at 400oC.  The polymer surface was
RF-sputtered followed by coating Cr (1000 o).  A relatively thick
layer (20 mm) of BPDA-PDA was coated and cured.  There was no
delamination of the metal layer from the wafer dur...