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Electrophotographic Imaging of Printed Circuit Board Substrates

IP.com Disclosure Number: IPCOM000109784D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

Allen, RD: AUTHOR [+3]

Abstract

The circuitry of interconnection devices (termed "packages") is defined by lithographic processes. Photoresists are applied from solutions containing an organic solvent, either directly to the substrate or to a polyester sheet which is then applied to the substrate. After an imagewise exposure, the pattern is developed, typically with an aqueous base. Both photoresist application and development result in very large quantities of chemical waste which must be treated and disposed. What we propose here and demonstrate is a technique which would eliminate chemical waste from the application step, and which would eliminate the need for chemical development entirely. The patterning process we propose for the printed-circuit board manufacturing plant of the future consists entirely of the guts of a photocopier.

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Electrophotographic Imaging of Printed Circuit Board Substrates

       The circuitry of interconnection devices (termed
"packages") is defined by lithographic processes.  Photoresists are
applied from solutions containing an organic solvent, either directly
to  the substrate or to a polyester sheet which is then applied to
the substrate.  After an imagewise exposure, the pattern is
developed, typically with an aqueous base.  Both photoresist
application and development result in very large quantities of
chemical waste which must be treated and disposed.  What we propose
here and demonstrate is a technique which would eliminate chemical
waste from the application step, and which would eliminate the need
for chemical development entirely.  The patterning process we propose
for the printed-circuit board manufacturing plant of the future
consists entirely of the guts of a photocopier. The etching resist
consists of a polymer material which is applied to the substrate in
an imagewise fashion by using a electrophotographic process.  The
resist requirements are greatly simplified in that formulations need
only to contain one component (a wet etch-resistant polymer), without
the photo-active components which normally degrade other properties
of conventional photoresist (toxicity, shelf-life, etc.).

      The circuit board plant of the future in our view would thus
consist of modified photocopiers to print the images, followed by
etch/strip spray chambers.  This wo...