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Hermetically Sealed, Field Removable Module Having an Integral Pump and Coolant Heat Exchanger for Forced Convection Immersion Cooling of Electronic Circuit Modules

IP.com Disclosure Number: IPCOM000109890D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Anderson, TM: AUTHOR [+4]

Abstract

Some high performance circuit modules have pistons that conduct heat away from semiconductor chips to a suitable water or air cooled cold plate. By convention, this approach is known as conduction cooling. In other modules, chips are immersed in a dielectric liquid, so that heat is dissipated from the chips directly to this liquid and through any fins that are in thermal contact with the chip. Such modules are said to be immersion-cooled. Both cooling schemes require a suitable apparatus to distribute the coolant to and circulate it through each of the modules in the machine. Due to inherent differences in the properties of the fluids, the coolant circulators for conduction and immersion cooling are not interchangeable.

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Hermetically Sealed, Field Removable Module Having an Integral Pump and Coolant Heat Exchanger for Forced Convection Immersion Cooling of Electronic Circuit Modules

       Some high performance circuit modules have pistons that
conduct heat away from semiconductor chips to a suitable water or air
cooled cold plate.  By convention, this approach is known as
conduction cooling.  In other modules, chips are immersed in a
dielectric liquid, so that heat is dissipated from the chips directly
to this liquid and through any fins that are in thermal contact with
the chip. Such modules are said to be immersion-cooled.  Both cooling
schemes require a suitable apparatus to distribute the coolant to and
circulate it through each of the modules in the machine.  Due to
inherent differences in the properties of the fluids, the coolant
circulators for conduction and immersion cooling are not
interchangeable.  Greater need for contamination control in immersion
cooling, since a single source of contamination can be dispersed by
the coolant and expose chips in every module to direct contact,
further distinguishes the various types of coolant circulators.  This
need for different system level cooling to support conduction and
immersion cooling can impede the installation of advanced
immersion-cooled machines wherever they have been preceded by
conduction-cooled machines.

      This invention is a cooling scheme for electronic packages 100
in which a dielectric coolant is herme...