Browse Prior Art Database

A Novel On-chip Thermoelectric Cooling Device

IP.com Disclosure Number: IPCOM000109942D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-24
Document File: 1 page(s) / 68K

Publishing Venue

IBM

Related People

Hsu, L: AUTHOR

Abstract

A new concept of on-chip thermoelectric cooling disclosed here will be able to effectively remove heat from today's high-speed/ high-power semiconductor chips. A method of building such high-efficiency solid-state thermoelectric cooling devices (or heat pumps) on the back side of the chip (or wafer) is proposed. The thermoelectric cooling devices are built using low temperature processes (below 350~C), therefore the performance of the built devices on the front side of the wafer would not be affected.

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A Novel On-chip Thermoelectric Cooling Device

      A new concept of on-chip thermoelectric cooling disclosed here
will be able to effectively remove heat from today's high-speed/
high-power semiconductor chips.  A method of building such
high-efficiency solid-state thermoelectric cooling devices (or heat
pumps) on the back side of the chip (or wafer) is proposed.  The
thermoelectric cooling devices are built using low temperature
processes (below 350~C), therefore the performance of the built
devices on the front side of the wafer would not be affected.

      The advantages of using such on-chip heat pump are: (1) the
design of the heat pump can be tailored to meet the chip thermal
dissipation requirements; (2) due to an intimate contact of heat pump
to the chip, very high efficiency of chip cooling can be achieved;
(3) no mounting is required; (4) the overall cost is low, because the
existing VLSI fabrication processes are used; and (5) the same
technique can be used to build cascading heat pump to accomplish
greater capability of heat removal.

      Two major materials used here are new to the field of
thermoelectric cooling module.  PECVD diamond film (since it is known
to be a good thermal conductor and electrical insulation) is used to
form the hot and the cold plate to improve thermal dissipation.  In
contrast, polyimide film (since it is a good electrical and thermal
insulator) is used to fill inside the heat pump devices to prevent
thermal leakage...