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A Polyimide Blend with Superior Laminated Self Adhesion and High Temperature Stability

IP.com Disclosure Number: IPCOM000109952D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 28K

Publishing Venue

IBM

Related People

Narayan, C: AUTHOR [+2]

Abstract

Disclosed is a novel method to formulate an adhesive that is stable up to 400~C. The process involves blending two polyimide precursors, typically amic-acids, to obtain a mixture with low Tg .

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A Polyimide Blend with Superior Laminated Self Adhesion and High Temperature Stability

      Disclosed is a novel method to formulate an adhesive that is
stable up to 400~C.  The process involves blending two polyimide
precursors, typically amic-acids, to obtain a mixture with low Tg .

      Polyimides typically have very poor adhesion to other
polyimides when laminated.  To fabricate composites of two
polyimides, it is usually necessary to use an adhesive layer between
them during lamination.  This invention teaches how superior
laminated adhesion can be achieved, without an adhesive, by starting
with a polyimide blend that has low Tg compared with the Tg's of both
the starting polyimides. Experiments with a blend of PMDA-ODA and
BPDA-PDA precursors show that the resultant polymer has a Tg that is
below 400~C.  The laminated structure has a peel strength of 118
g/mm.  The laminated self adhesion of either component is less than 5
g/mm.

      Disclosed anonymously.