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Inductive Recording Head Design for Electrochemical Potential Control

IP.com Disclosure Number: IPCOM000109953D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 77K

Publishing Venue

IBM

Related People

Andricacos, P: AUTHOR [+5]

Abstract

An inductive magnetic recording head design allowing electrochemical potential control of the pole tip region is disclosed. A copper strip attached to the back-gap of the pole piece is deposited during head fabrication. This strip leads to an extra bond pad at the trailing edge. Electrical contact can thus be made to the pole tips enabling electrochemical potential control. (Image Omitted)

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Inductive Recording Head Design for Electrochemical Potential Control

      An inductive magnetic recording head design allowing
electrochemical potential control of the pole tip region is
disclosed.  A copper strip attached to the back-gap of the pole piece
is deposited during head fabrication.  This strip leads to an extra
bond pad at the trailing edge.  Electrical contact can thus be made
to the pole tips enabling electrochemical potential control.

                            (Image Omitted)

      It is often possible to improve the corrosion resistance of
metals by exposure to aqueous solutions under appropriate conditions
of potential, pH and presence of certain anions to form a passive
film on the metal surface.  In general, it is known that passive film
thickness and protectiveness increases with passivation potential.
Electrochemical potential control of the pole tip region of inductive
recording heads is not simple, however, since the pole pieces are
isolated electrically with no way to make electrical contact.

      The disclosed design allows for electrical connection to the
pole tips by deposition of a metallic strap directly on top of the
back gap of the pole piece, as shown schematically in the figure.  If
this strap is nonmagnetic, such as Cu, it will not interfere with the
operation of the head.  The strap leads to a bond pad at the trailing
edge and is itself not exposed at the air bearing surface.  No new
ste...