Browse Prior Art Database

Air Baffle for Planar Memory Cooling

IP.com Disclosure Number: IPCOM000110040D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

Barina, RM: AUTHOR [+4]

Abstract

Described is a hardware implementation that provides an air baffle for planar memory units, as used in personal computer (PC) systems, to direct sufficient airflow so as to increase the heat transfer at the planar memory units.

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Air Baffle for Planar Memory Cooling

       Described is a hardware implementation that provides an
air baffle for planar memory units, as used in personal computer (PC)
systems, to direct sufficient airflow so as to increase the heat
transfer at the planar memory units.

      Fig. 1 shows the air baffle and Fig. 2 shows how the air baffle
is positioned in relation to the planar memory units of the PC.  The
air baffle is designed to capture sufficient airflow and to change
the airflow direction by 90 degrees.  The change of airflow direction
causes the air to travel in line with the length of the planar memory
modules, rather than having the air flow up and over the modules.
This provides cooling to both sides of the modules.  The air baffle
is designed with a hinge so that access can be easily made to the
planar memory units.

      The air baffle is designed to increase the convection force
which, in turn, increases the coefficient of heat transfer.  The heat
transfer coefficient is defined by: h = Q/(Tx-Ta)A, where Q is the
total heat transfer rate; Tx is the temperature of the planar memory
unit; Ta is the ambient temperature of the planar memory unit; and A
is the surface area of the planar memory.  By using the air baffle,
the surface area of heat transfer is approximately doubled.  This
increases the heat transfer and reduces the temperature at the planar
memory unit.