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Process for Making Interleaved Magnetic Head

IP.com Disclosure Number: IPCOM000110063D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 48K

Publishing Venue

IBM

Related People

Stern, GC: AUTHOR [+3]

Abstract

A multi-track bidirectional index thin film head can be made by an improved process that requires only two masks to complete the interleaved head assembly.

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This is the abbreviated version, containing approximately 64% of the total text.

Process for Making Interleaved Magnetic Head

       A multi-track bidirectional index thin film head can be
made by an improved process that requires only two masks to complete
the interleaved head assembly.

      In this process, the read and write devices are deposited
simultaneously on ferrite substrates.  The process starts with the
deposition of an alumina layer onto the ferrite substrate.  Next, a
layer of nickel-iron is deposited onto the alumina layer to act as a
magnetoresistive (MR) element.  A titanium shunt layer is then
deposited to bias the MR element.  A second alumina layer is then
deposited followed by the deposition of the conductor layer of gold,
for instance, to interconnect the MR element to the connecting leads.
The write coil is deposited at the same time as the conductor layer
of gold.

      The first mask of photoresist defines the read and element
lapping guide patterns.  The mask outline is defined by sputter
etching the devices.  A second mask of photoresist is used to
chemically etch both alumina layers from the write track regions and
the second alumina layer from the read and electrical lapping guide
terminals.  The write coil is patterned by using a lift-off process.

      Both the read and the write elements can be simultaneously
processed using the above process with two masks.  Thus, in the first
mask, the read and electrical lapping guide track patterns are
defined in a sputter etching process.  In the second...