Browse Prior Art Database

Area Array Attachment for Power and Signal Interconnection of Multi-chip Modules

IP.com Disclosure Number: IPCOM000110149D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 63K

Publishing Venue

IBM

Related People

Foster, RA: AUTHOR [+3]

Abstract

In packaging of densely packed multi-chip modules (MCM), it is desirable to reserve the entire surface area of the substrate for chip attachment. The connector/cable interconnect system must therefore be attached to the substrate elsewhere. Additionally, module power is generally delivered through an array of pins which limits the bottom surface area that is available for connection of signal I/O.

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This is the abbreviated version, containing approximately 66% of the total text.

Area Array Attachment for Power and Signal Interconnection of Multi-chip Modules

      In packaging of densely packed multi-chip modules (MCM), it is
desirable to reserve the entire surface area of the substrate for
chip attachment.  The connector/cable interconnect system must
therefore be attached to the substrate elsewhere.  Additionally,
module power is generally delivered through an array of pins which
limits the bottom surface area that is available for connection of
signal I/O.

      An earlier attempt to solve this problem in an application was
proposed which utilized surface soldering of a flex cable with an
array of pads for the signal I/O, moving the interconnection from the
top to the bottom of the substrate.  The present disclosure extends
this concept to include I/O in an area array over the entire bottom
area of the substrate, and suggests use of a power bus for power
distribution.

      The concept can be described by examination of Figure 1. The
MCM (1) contains solder bumps (2) arranged in an area array, as
shown, so that the module can be surface soldered.  The attachment
will be done on an organic carrier (3) to a matching pad array.  The
carrier is connected through another pad array connector (5) to the
next level of assembly. The carrier is backed by a laminated power
supply (4) consisting of copper power planes which are used to
distribute power to the module.  The approach presented requires use
of a matched expansion carrier suc...