Browse Prior Art Database

Liquid Crystal Polymer IC Card Assembly Fixture, Wave Solder, and Mask

IP.com Disclosure Number: IPCOM000110156D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 122K

Publishing Venue

IBM

Related People

Bourgault, VA: AUTHOR [+3]

Abstract

An injection molded Liquid Crystal Polymer (LCP) circuit card assembly fixture, wave solder fixture, and mask is disclosed.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Liquid Crystal Polymer IC Card Assembly Fixture, Wave Solder, and Mask

       An injection molded Liquid Crystal Polymer (LCP) circuit
card assembly fixture, wave solder fixture, and mask is disclosed.

      The injection molded Liquid Crystal Polymer (LCP) circuit card
assembly fixture, wave solder fixture, and mask (henceforth called a
cardframe) performs the exact same function as the former machined
and manually assembled fixture.  These cardframes are first used as
an assembly fixture to hold the circuit card during the manual
insertion of the chips and components.  The cardframes are also used
during the soldering operation and function not only to convey the
circuit card through the solder bath but also serve as a solder mask
preventing solder from entering into areas requiring protection
during this operation.

      What differentiates the injection molded cardframe from the
assembled cardframe is that, except for the assembly of the hold down
clips, there are no machining or assembly operations required to
construct it.  It is complete as molded.  The cardframe molded from
the LCP offers many advantages over the predecessor, the main one
being the high temperature resistance of the LCP material making it
suitable to withstand the soldering operation.  The LCP used was
Vectra C-150 from Hoechst Celanese, but a number of the Xydar LCP's
from Amoco Performance Products would also work.

      Fig. 1 shows the old machined and assembled cardframe, and Fig...