Browse Prior Art Database

Conductive Heat Probe for Module De-solder and Removal

IP.com Disclosure Number: IPCOM000110163D
Original Publication Date: 1992-Sep-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 95K

Publishing Venue

IBM

Related People

Davis, GA: AUTHOR [+4]

Abstract

This article describes a tool for the de-solder and removal of modules from a substrate.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 58% of the total text.

Conductive Heat Probe for Module De-solder and Removal

       This article describes a tool for the de-solder and
removal of modules from a substrate.

      An existing module de-solder and removal tool uses infrared
(IR) radiant heat to remove silicon integrated circuits (ICs) from a
substrate surface.  This heat transfer mechanism is effective because
the silicon absorbed 50% of the IR heat.

      Another concept for a de-solder and removal probe uses a
hot-gas flow to heat the module for de-solder and vacuum for removal.
The hot-gas of the probe must be exhausted at the bottom, near
adjacent modules, potentially causing their partial de-solder.  Also,
the hot-gas heaterelement (an exposed filament) must be turned-off,
prior to vacuum being applied, to avoid burning the element.

      The conductive heat probe disclosed herein is shown in the
figure placed over the module to be removed from the substrate.  A
large number of small diameter, heat transfer rods are used to
conduct heat from an encased heater-block, to the irregular surface
of the module, for the de-solder operation.  It will use vacuum for
removal of the module, but the vacuum can be applied from the start
of the de-solder operation.

      An assembly of silicon chips and capacitors are attached to the
module.  The module must be removed by heating the solder balls to a
temperature above the solder melting point while applying vacuum.
When the solder melts, the probe is lifted,...