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Browse Prior Art Database

Solder Ball Connect Pin Grid Array Package

IP.com Disclosure Number: IPCOM000110194D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Mills, GT: AUTHOR

Abstract

An adapter is described that allows the use of existing and new pin grid array (PGA) packages with solder ball connect (SBC) technology. An example of the proposed insulator adapter used to mount a standard PGA module on a card is shown in the figure. The insulator is drilled or molded with a hole pattern that matches the footprint of the PGA module. The bottom side of the insulator is recessed to hold solder or solder paste, as well as a metal ball. The metal ball may be a high-temperature solder ball, or it may be tinned or gold-plated. After the PGA module pins are inserted into the insulator adapter from the top, low temperature solder is reflowed to bond the pins to the ball and the ball to the card.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solder Ball Connect Pin Grid Array Package

      An adapter is described that allows the use of existing and new
pin grid array (PGA) packages with solder ball connect (SBC)
technology.  An example of the proposed insulator adapter used to
mount a standard PGA module on a card is shown in the figure.  The
insulator is drilled or molded with a hole pattern that matches the
footprint of the PGA module.  The bottom side of the insulator is
recessed to hold solder or solder paste, as well as a metal ball.
The metal ball may be a high-temperature solder ball, or it may be
tinned or gold-plated.  After the PGA module pins are inserted into
the insulator adapter from the top, low temperature solder is
reflowed to bond the pins to the ball and the ball to the card.  A
loose fit between the PGA pins and the insulator hole diameters will
allow the PGA module to settle down until either the pins rest on the
tops of the balls or the module base rests on the insulator.  Pin
length can be set by design or by shearing the pins.  In the figure a
small space is left between the module and the insulator, but no
space is required.  The height of the top of the PGA module above the
card surface is determined by:
       1. the module pin length, and
       2. the thickness of the insulator adapter.

      Disclosed anonymously.