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Double Sided Surface Mount Card Edge Connector

IP.com Disclosure Number: IPCOM000110210D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Becker, DJ: AUTHOR

Abstract

A surface-mount connector concept was developed to allow the high densities achievable with a double-sided surface-mount assembly process. This connector would consist of two separate identical pieces that would mount on opposite sides of the printed circuit board. A third piece, a connecting fastener pin, would protrude through both connector halves and the printed circuit board to tie all of the parts together.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 86% of the total text.

Double Sided Surface Mount Card Edge Connector

      A surface-mount connector concept was developed to allow the
high densities achievable with a double-sided surface-mount assembly
process.  This connector would consist of two separate identical
pieces that would mount on opposite sides of the printed circuit
board.  A third piece, a connecting fastener pin, would protrude
through both connector halves and the printed circuit board to tie
all of the parts together.

      The top half (A) and bottom half (B) of the connector could be
identical so only one part and one manufacturing mold would be
needed.  When mounted the two halves would make contact with each
other beyond the edge of the printed circuit board (E).  This contact
would allow for thickness variations in the printed circuit board
below a maximum allowable board thickness.  Alignment posts (D) would
protrude into the printed circuit board to align the connector halves
during the assembly soldering operation.  The connecting fastener pin
(C) would be inserted when the second connector half was to be
soldered.  This pin, when tightly in place, would provide a retention
force for the connector during its mating cycle, thus reducing stress
on the soldered surface-mount joints.  Additional rows of solder pads
(F) could be added to achieve an even higher density connector with
this same concept.

      The connector could be assembled to the printed circuit board
using existing surface-mount man...