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Simultaneous Laser Polymer via Etch and Fill

IP.com Disclosure Number: IPCOM000110224D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Donelon, JJ: AUTHOR [+3]

Abstract

Simultaneous laser-induced etching and plating of metal on a polymer, e.g., polyimide, is achievable using a single electrolyte and an optical beam operated at a fixed power level.

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Simultaneous Laser Polymer via Etch and Fill

      Simultaneous laser-induced etching and plating of metal on a
polymer, e.g., polyimide, is achievable using a single electrolyte
and an optical beam operated at a fixed power level.

      As shown in cross-sectional view, a metal pattern 1 is disposed
on side 2 of polymer layer 3.  Metal pattern 4 is disposed on side 5
of polymer layer 3.  Side 5 of layer 3 is contacted with an
electrolyte and irradiated with a selectively focussed optical beam
to simultaneously etch via hole 6 in layer 3 and fill via hole 6 with
metal deposited from the electrolyte to form via or stud 7.

      When an electrolyte, such as a gold plating solution, e.g.,
Nueutronex 309 (manufactured by Selrex, a subsidiary of Oxy-Metal) or
Autronex 55 GV (also manufactured by Selrex) is irradiated, a gold
stud is formed.  The focused optical beam can be provided by a laser,
e.g., an argon laser.

      Disclosed anonymously.