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Browse Prior Art Database

Removable Teflon Protection

IP.com Disclosure Number: IPCOM000110226D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Feger, C: AUTHOR [+2]

Abstract

A method is disclosed to protect certain areas of a substrate from contamination by resists or polymeric dielectrics during processing.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Removable Teflon Protection

      A method is disclosed to protect certain areas of a substrate
from contamination by resists or polymeric dielectrics during
processing.

      Many electronic products require processes in which polymeric
dielectrics, like polyimides and/or photoresists, need to be confined
to certain areas of substrates without contaminating other areas.
This is now easily possible with the herein disclosed process which
makes use of du Pont's Teflon AF, a soluble, commercially available
perfluorocarbon.  The process takes advantage of Teflon AF's low
surface tension which eliminates adherence of other polymers like
polyimides to it, its unsurpassed solvent resistance (it dissolves
only in fully fluorinated solvents), and its high temperature
stability which allows processing at temperatures up to 330~C.

      In the process, Teflon AF is first deposited from solution onto
the area of the substrate that needs to be protected.  Subsequently,
polymeric dielectric or photoresist is applied over the whole
surface.  The solution will retract from the areas protected by
Teflon AF.  The substrate then undergoes any processing necessary.
Once the protection is no longer needed, Teflon AF is removed by
dissolving in a suitable solvent.

      Disclosed anonymously.