Browse Prior Art Database

Grease Filled Thermal Interface Materials

IP.com Disclosure Number: IPCOM000110227D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Liutkus, JJ: AUTHOR [+3]

Abstract

Disclosed is a grease-filled thermal interface material consisting of a core material, such as a sheet of thermally conductive polymer, such as boron-nitride filled silicone, with pre-punched holes and thermally enhanced grease, such as oil mixed with ZnO powder. The thermal grease is applied to the sheet after the holes are punched. The size of the holes in the sheet depends on the rheological characteristics of the grease. Once all of the holes in the sheet are filled with grease, it can be cut into any shape and stocked as preformed thermal pads for production usage. When a grease-filled thermal pad is placed between an electronic package and a heat sink, a small force is applied to the heat sink to compress the thermal pad.

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Grease Filled Thermal Interface Materials

      Disclosed is a grease-filled thermal interface material
consisting of a core material, such as a sheet of thermally
conductive polymer, such as boron-nitride filled silicone, with
pre-punched holes and thermally enhanced grease, such as oil mixed
with ZnO powder.  The thermal grease is applied to the sheet after
the holes are punched. The size of the holes in the sheet depends on
the rheological characteristics of the grease.   Once all of the
holes in the sheet are filled with grease, it can be cut into any
shape and stocked as preformed thermal pads for production usage.
When a grease-filled thermal pad is placed between an electronic
package and a heat sink, a small force is applied to the heat sink to
compress the thermal pad.  This small compressive force will deform
the the core material of the thermal pad and squeeze a small amount
of grease out of the holes to fill the air gaps at the interfaces.
The core material also acts as a barrier to retain the grease and
therefore extends the life of the thermal pad.  The core material for
the grease-filled thermal interface materials can be a metal mesh if
electrical isolation between a package and a heat sink is not
required.  Copper mesh is preferred since it is a very good thermal
conductor.

      Disclosed anonymously.