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Method of Heat Sinking an Array of Discrete Electronic Packages

IP.com Disclosure Number: IPCOM000110229D
Original Publication Date: 1992-Oct-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 52K

Publishing Venue

IBM

Related People

Mok, LS: AUTHOR

Abstract

Disclosed is a method of using a common heat sink to cool an array of discrete electronic packages or modules. Fig. 1 is a simplified 3-D view of a common heat sink on an array of modules. The common heat sink 11 is hinged on a support frame 12 which is mounted on a printed-wiring board 21. As shown in Fig. 1, the heat sink 11 is in release mode. In operating mode, the heat sink 11 is secured on the frame 12 and is in intimate contact with the modules 31. The cross-sectional view of the heat sink with a module is shown in Fig. 2. The module 31 has a substrate 32 with pins 33 and a semiconductor chip 34 mounted on. A piece of thermally conductive preform 35 is placed between the chip 34 and the metal cap 36. The shape of the cap 36 is so designed that it fits into the slot 13 of the heat sink 11.

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Method of Heat Sinking an Array of Discrete Electronic Packages

      Disclosed is a method of using a common heat sink to cool an
array of discrete electronic packages or modules.  Fig. 1 is a
simplified 3-D view of a common heat sink on an array of modules.
The common heat sink 11 is hinged on a support frame 12 which is
mounted on a printed-wiring board 21.  As shown in Fig. 1, the heat
sink 11 is in release mode.  In operating mode, the heat sink 11 is
secured on the frame 12 and is in intimate contact with the modules
31.  The cross-sectional view of the heat sink with a module is shown
in Fig. 2.  The module 31 has a substrate 32 with pins 33 and a
semiconductor chip 34 mounted on.  A piece of thermally conductive
preform 35 is placed between the chip 34 and the metal cap 36.  The
shape of the cap 36 is so designed that it fits into the slot 13
of the heat sink 11.  The semiconductor chip 34 can be housed in
other types of electronic packages such as a molded plastic package
provided that the upper portion of the package has the similar shape
as the cap 36.  Two pieces of thermally conductive preforms 14 and 15
are placed between the cap 36 and the heat sink 11.  When the heat
sink 11 is in the operating mode, the bottom of the heat sink will
compress the thermal preforms 14 and 15 to make a good thermal path
for heat to flow from the cap 36 to the heat sink 11.  The thermal
preform 14 could be pure solid, liquid, or a mixture of both.  If the
preform...