Browse Prior Art Database

U-vac Vacuum Pen Tip Tool

IP.com Disclosure Number: IPCOM000110258D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Volant, RP: AUTHOR

Abstract

A technique is described whereby a U-vac vacuum pen tip tool provides the ability to handle semiconductor wafers from the wafer's front side. The intent of the design is to reduce wafer contamination and to eliminate damage to devices mounted on the wafer.

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U-vac Vacuum Pen Tip Tool

       A technique is described whereby a U-vac vacuum pen tip
tool provides the ability to handle semiconductor wafers from the
wafer's front side.  The intent of the design is to reduce wafer
contamination and to eliminate damage to devices mounted on the
wafer.

      The U-vac pen tip tool, as shown in Fig. 1, is designed to
enable a user to pick up a wafer with minimal contact, so as to
minimize contamination and potential damage to devices on the wafer.
The tool has a hollow stem 10 and handle 11 to enable a vacuum to
flow from handle 11 through stem 10 to the trench embedded in U
section 13.  U section 13 can be placed on top of the wafer (not
shown) without damaging the wafer, because the tool engages only 4 mm
beyond the edge of the wafer, as shown in Fig. 2.  The tool is
designed to be scaled up to any wafer size so as to meet future
needs.