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Structure and Manufacturing Process of Coils

IP.com Disclosure Number: IPCOM000110396D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Itoh, S: AUTHOR

Abstract

Disclosed is a structure and manufacturing process of a coil that has high space factor, accuracy of dimension and connectability to circuits. This coil assembly consists of three parts; a coil, a bobbin and a polymer thin film (Fig. 1). As shown in Fig. 2, the bobbin is cylindrical in shape with a flange that has a terminal on the outside diameter. The coil is made of a self-bonding wire and is previously wound required turns into a cylindrical shape. The coil is put onto the bobbin. After applying organic solvent to the surface of the coil (to activate adhesive on the self-bonding wire), the polymer thin film is put onto the coil. This assembly is cured at high temperature under pressure so that curing the coil and bonding the polymer thin film to the coil are done at the same time.

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Structure and Manufacturing Process of Coils

       Disclosed is a structure and manufacturing process of a
coil that has high space factor, accuracy of dimension and
connectability to circuits.  This coil assembly consists of three
parts; a coil, a bobbin and a polymer thin film (Fig. 1).  As shown
in Fig. 2, the bobbin is cylindrical in shape with a flange that has
a terminal on the outside diameter.  The coil is made of a
self-bonding wire and is previously wound required turns into a
cylindrical shape.  The coil is put onto the bobbin.  After applying
organic solvent to the surface of the coil (to activate adhesive on
the self-bonding wire), the polymer thin film is put onto the coil.
This assembly is cured at high temperature under pressure so that
curing the coil and bonding the polymer thin film to the coil are
done at the same time.

      This type of coil assembly has the following advantages.
First, the coil assembly is able to have higher space factor for the
following reasons;
1)   The flange can be thinner because it is on only one side of the
bobbin and the length of resin flow can be shortened in injection
molding (Fig. 3).
2)   The polymer thin film on the other side is thinner than a flange
of the bobbin by injection molding.
3)   The polymer thin film is bonded on the coil by adhesive on the
self-bonding wire, not by using any other adhesives.
4)   Curing under pressure allows excessive adhesive on the self-
bonding wire to run off.

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