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Offset Alignment of Core for Wire Matrix Printhead

IP.com Disclosure Number: IPCOM000110402D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Akino, M: AUTHOR [+2]

Abstract

Disclosed is a technique to align the offset core location of the wire matrix printhead which is able to grid tapered core surface.

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This is the abbreviated version, containing approximately 67% of the total text.

Offset Alignment of Core for Wire Matrix Printhead

       Disclosed is a technique to align the offset core
location of the wire matrix printhead which is able to grid tapered
core surface.

      A High Speed Spring Charge type printhead requires the tapered
offset 1 between armature and core, because the tapered offset can
use the magnetic circuit effectively, as shown in Fig. 1.  Fig. 2
shows the high speed double layer type printhead, and this type
prithead has the double diamond shape top wire guide holes.  Refer to
Fig. 3.  Inner diamond wire holes are for the rear part spring
assemblies, outer diamond wire holes are for the front part spring
assemblies.

      The wire guide is designed to reduce the wire moving resistance
and the stress.  So inner diamond wire holes are designed to be
nearly circle as the wire root 3.  The outer diamond wire holes must
be offset from the center to assemble the spring assembly and wire
guide.  But the same spring assemblies alignment as rear part spring
assemblies (refer to Fig. 4) causes some stress and resistance
between wires and wire guide.  If the spring assemblies and cores
alignment are only shift as the outer diamond wire holes, the
distance between each core and the working rotation center is
different.  The difference of the distance causes the variety of the
grind core to offset.  As a consequence, the variety of core offset
affects the characteristics of the spring assemblies, especially the
wire str...