Browse Prior Art Database

The Use of Microwave Energy to Enhance the Moisture Bakeout Process of Plastic Encapsulated Electronic Components

IP.com Disclosure Number: IPCOM000110426D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 50K

Publishing Venue

IBM

Related People

Burns, RW: AUTHOR [+3]

Abstract

Plastic encapsulated electronic components, by their very nature absorb moisture from the environment. The rate at which these packages take in water and the rate at which it can be baked-out is very dependent on the package thickness, type of package, type of inner leadframe, package material, etc. There is a critical moisture level that a given package can obtain prior to exhibiting severe cracking when the package is exposed to high temperatures, such as that seen when the SMT component is subjected to the IR reflow process. Typically, these packages are either stored in a dry room or the moisture is baked out before reflow, thus eliminating the possibility of cracking. Depending on the temperature used for baking and the package size, this baking process can take anywhere from a few hours to 24 hours or more.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

The Use of Microwave Energy to Enhance the Moisture Bakeout Process of Plastic Encapsulated Electronic Components

      Plastic encapsulated electronic components, by their very
nature absorb moisture from the environment.  The rate at which these
packages take in water and the rate at which it can be baked-out is
very dependent on the package thickness, type of package, type of
inner leadframe, package material, etc.  There is a critical moisture
level that a given package can obtain prior to exhibiting severe
cracking when the package is exposed to high temperatures, such as
that seen when the SMT component is subjected to the IR reflow
process.  Typically, these packages are either stored in a dry room
or the moisture is baked out before reflow, thus eliminating the
possibility of cracking.  Depending on the temperature used for
baking and the package size, this baking process can take anywhere
from a few hours to 24 hours or more.
DISCLOSED: By using microwave energy of the appropriate frequency for
the heating of water, then fine tuning this frequency and optimizing
its intensity (so that the water is heated internally at a rate such
that steam is not produced), the moisture content in a plastic
electronic component package can be eliminated.  Using microwave
energy for heating instead of the conventional, convection-type oven,
the length of time to bake out the moisture can be reduced
significantly.

      Anonymous.