Browse Prior Art Database

Ultra Fine Pitch QFP or TAB Assembly Technique

IP.com Disclosure Number: IPCOM000110431D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Related People

Bonnell, RE: AUTHOR [+3]

Abstract

Disclosed is a Fixture that allows components, such as TAB and Ultra-fine Pitch QFP's, to be reflowed in an infrared oven. The fixture is a small nonwettable frame (Titanium or Ceramic) which would be placed on the component leads either at the time of the component placement in paste or immediately prior to reflow. The whole card would then be run through the reflow oven and the total assembly soldered. The fixture would then be removed and the assembly cleaned. Fig. 1 shows a cross section of a printed wiring board, component and the disclosed fixture. Fig. 2 shows a full outline of the fixture. The fixture would be optimized for each specific component and card type. The disclosed fixture would decrease opens and eliminate the requirement for a separate soldering step for these types of components.

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Ultra Fine Pitch QFP or TAB Assembly Technique

      Disclosed is a Fixture that allows components, such as TAB and
Ultra-fine Pitch QFP's, to be reflowed in an infrared oven.  The
fixture is a small nonwettable frame (Titanium or Ceramic) which
would be placed on the component leads either at the time of the
component placement in paste or immediately prior to reflow.  The
whole card would then be run through the reflow oven and the total
assembly soldered.  The fixture would then be removed and the
assembly cleaned.  Fig. 1 shows a cross section of a printed wiring
board, component and the disclosed fixture.  Fig. 2 shows a full
outline of the fixture.  The fixture would be optimized for each
specific component and card type.  The disclosed fixture would
decrease opens and eliminate the requirement for a separate soldering
step for these types of components.

      Disclosed anonymously.