Browse Prior Art Database

Process to Monitor Bond Integrity in Ultrasonic Bonding

IP.com Disclosure Number: IPCOM000110463D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 51K

Publishing Venue

IBM

Related People

Bellacicco, JA: AUTHOR [+3]

Abstract

Disclosed is a technique to precisely monitor the input energy to a ultrasonic bond at the instant when the bond is made. Moreover, this technique uses the Seebeck voltage for temperature measurement which is produced when the tungsten-carbide bond tip contacts the gold wire used for circuit personalization.

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Process to Monitor Bond Integrity in Ultrasonic Bonding

      Disclosed is a technique to precisely monitor the input energy
to a ultrasonic bond at the instant when the bond is made.  Moreover,
this technique uses the Seebeck voltage for temperature measurement
which is produced when the tungsten-carbide bond tip contacts the
gold wire used for circuit personalization.

      Referring to Figure 1, piezoelectric bond horn 1 and bond tip 2
are shown contacting gold wire 3.  At the instant when AC power is
applied to bond horn 1, the voltage is sensed at connection 8 as well
as current at connection 7 by multiple-input high-speed signal
analyzer 10. Simultaneously, bond tip 2 displacement is sensed by a
fiber-optic fotonic sensor 5 which is conditioned power and
displacement, the junction temperature of the gold wire 3 and the
tungsten-carbide bond tip 2 is conditioned to a linear signal by
temperature signal conditioner 4 and also sampled by signal analyzer
10.  This junction temperature is a function of the work required to
achieve a quality bond and can thus be characterized as a temperature
envelope to permit postprocessing by controller 11.  In this manner,
temperature, tip displacement, and bond horn power can be sampled and
compared to known signal analyzer profiles of quality bonds which
will yield a figure of merit for the present bond.

      Disclosed anonymously.