Browse Prior Art Database

TCM Vacuum Chamber

IP.com Disclosure Number: IPCOM000110467D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 45K

Publishing Venue

IBM

Related People

Kott, G: AUTHOR [+3]

Abstract

This invention eliminates mechanical stress on encapsulated module while oil filling and also eliminates the purging of the oil line which is necessary when evacuating and filling from one orifice.

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TCM Vacuum Chamber

      This invention eliminates mechanical stress on encapsulated
module while oil filling and also eliminates the purging of the oil
line which is necessary when evacuating and filling from one orifice.

      The current process pulls vacuum inside the module only,
creating a pressure difference between the inside and outside of the
module.  This pressure difference puts a stress on the substrate and
hat which can possibly cause cracks.

      The current process also requires that the oil line be purged
each cycle, due to the fact that the module is evacuated and filled
through the same orifice.  The vacuum chamber will eliminate that
process, shortening the process time and reducing the complexity of
the tool.

      By placing the entire module in a vacuum chamber and then
pulling a vacuum, there will be no pressure difference between inside
and out of the module, thus eliminating the stresses on the
substrate.  Refer to Figure 1.  Once the desired vacuum is reached, a
linear feedthru moves the module up so the orifice mates and seals
with the oil path.  The module is then filled, lowered and removed.

      Some desirable features of this invention:
      1.   Elimination of stresses on substrate during oil fill
process.
      2.   Eliminates complex system of valves required to fill a
module using only one orifice.

      Disclosed anonymously.