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Browse Prior Art Database

Thermal Break for Cards with Redundant Ground or Power Planes

IP.com Disclosure Number: IPCOM000110474D
Original Publication Date: 1992-Nov-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Isaacs, PD: AUTHOR

Abstract

Printed circuit boards requiring redundant ground and voltage planes can cause an insufficient solder fill condition. The idea to add more plated through holes (PTH) around the perimeter of the redundant plane connections facilitates the transfer of more heat from the solder operation which aids in complete hole fill.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Thermal Break for Cards with Redundant Ground or Power Planes

      Printed circuit boards requiring redundant ground and voltage
planes can cause an insufficient solder fill condition.  The idea to
add more plated through holes (PTH) around the perimeter of the
redundant plane connections facilitates the transfer of more heat
from the solder operation which aids in complete hole fill.

      To facilitate better heat transfer into redundant ground and
voltage plane connections to obtain better solder fillets can be done
by changing these three design rules on printed circuit boards:
1.   Have only single ground and voltage planes to the perimeter pins
on a module.
2.   By ground rules, add a complete extra row of PTHs around the
module in the same grid pattern.
3.   Add 3 extra PTHs around the adjacent PTHs with the redundant
ground pins.  If the module pinout pattern does not contain a a full
matrix of holes, it may be necessary to add extra PTHs within the PTH
pattern to obtain a full matrix of holes, again to facilitate good
heat transfer to the PTHs with redundant ground and voltage planes.
If these design changes are made, a better quality solder fillet can
be obtained at a higher throughput rate on the solder wave.

      Disclosed anonymously.