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Browse Prior Art Database

Continuous Feed Slurry Delivery System for Chemical Mechanical Polishing

IP.com Disclosure Number: IPCOM000110518D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Chandler, WF: AUTHOR [+3]

Abstract

A method for continuous slurry feed during chemical mechanical wafer polishing is disclosed. The system allows fresh slurry to be added at any time without interrupting the polish process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Continuous Feed Slurry Delivery System for Chemical Mechanical Polishing

       A method for continuous slurry feed during chemical
mechanical wafer polishing is disclosed.  The system allows fresh
slurry to be added at any time without interrupting the polish
process.

      Abrasive slurry is required for chemical mechanical polishing
of integrated circuit wafers.  A 20-liter carboy is the most widely
used slurry container in use today.  To enable fresh slurry to be
added to the carboy during the polish process without air intake into
the slurry lines, the carboy was modified.  Fixed slurry intake lines
were permanently attached to the topside of the carboy using a
modified bulk head connector, leaving the top of the container open
for refilling on the fly if necessary.  Once the carboy has been
filled with fresh slurry, the container cover can be reapplied.

      Since the carboy cover is in place at all times except when
refilling, contamination is very low.  This enables the slurry
delivery system to run without filtration.   A magnetic stirrer is
used under the carboy to keep the slurry in suspension.