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Metal/ Ceramic Composite Ring Assembly for Selective Tungsten Deposition

IP.com Disclosure Number: IPCOM000110580D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 49K

Publishing Venue

IBM

Related People

Brodsky, S: AUTHOR [+2]

Abstract

Described is a metal/ceramic composite ring assembly for selective tungsten deposition, as used during the fabrication of semiconductor wafers. The ring assembly is designed as a replacement for quartz plates, which are required to surround the wafer during fabrication processes in order to prevent the selectivity loss. The composite is considered superior to that of quartz plates in that the metal/ceramic is more durable and an order of magnitude less costly. In addition, the composite plates need not require cleaning, which increases the downtime of quartz plates.

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Metal/ Ceramic Composite Ring Assembly for Selective Tungsten Deposition

       Described is a metal/ceramic composite ring assembly for
selective tungsten deposition, as used during the fabrication of
semiconductor wafers.  The ring assembly is designed as a replacement
for quartz plates, which are required to surround the wafer during
fabrication processes in order to prevent the selectivity loss.  The
composite is considered superior to that of quartz plates in that the
metal/ceramic is more durable and an order of magnitude less costly.
In addition, the composite plates need not require cleaning, which
increases the downtime of quartz plates.

      Typically, a plate is required to surround a wafer during the
tungsten deposition operation to prevent selectivity breakdown which
starts at the perimeter of the wafer.  So as to enable selective W to
be manufacturable, a material involving refractory metals, or
stainless steel, and replaceable ceramics has been devised so that
there can be increasing heat dissipation at the edge.  Ceramic pins
are screwed to the metal, as opposed to quartz pins, to allow for
proper wafer holding and to maintain selectivity.  The pins help the
wafers to make good contact with the hot turret face, which is
necessary to prevent backside deposition and to maintain uniformity
of temperature and thickness.

      The design is similar to quartz plates except the pads which
touch the wafers are made of machineable ceramics.  The...