Browse Prior Art Database

SMT Far Applique Pad to Card Pad Connection

IP.com Disclosure Number: IPCOM000110581D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 3 page(s) / 81K

Publishing Venue

IBM

Related People

Brown, D: AUTHOR [+3]

Abstract

Disclosed is a method to provide a good quality solder joint between an applique pad and component site pad on the card. Any component shape on the card, for example, square, rectangle, round or PTH may be used.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 99% of the total text.

SMT Far Applique Pad to Card Pad Connection

       Disclosed is a method to provide a good quality solder
joint between an applique pad and component site pad on the card.
Any component shape on the card, for example, square, rectangle,
round or PTH may be used.

      Fig. 1 shows a pad shape on the applique.  This is a
double-sided pad where the top and bottom are electrically connected
through 1 and 1/2 plated hole located within pad area.  The presence
of 1 and 1/2 hole allow the operator to see and control soldering
operation in progress.  It also allows substantially more heat to be
delivered to the bottom side of the applique pad. The half round end
of the applique pad also restricts solder connection to card pad area
only.  Electrical connection is between top and bottom side of
applique.  When the soldering iron tip is placed at the full size
hole for good heat transfer and solder reflow on the card and
applique pads, additional solder or flux may be added to 1/2 hole end
for good connection.  The joint formed between the  applique and card
may be well observed.  The top view also shows relief on both sides
of the pad to allow the applique to be placed flat over the card top
surface with no interference with other leads.  The cross-section
shows solder joint between the 1 and 1/2 hole pad on applique and the
pad on the card.

      Figs. 2, 3 and 4 show cross-sections for the same type applique
connection for gull wing, J-lead and no lead, res...