Browse Prior Art Database

SMT Far Blind Via to Pad Connection

IP.com Disclosure Number: IPCOM000110583D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Brown, D: AUTHOR [+3]

Abstract

Disclosed are methods to provide a good quality solder joint between blind VIA pad on applique and any pad on the card, for example, square, rectangle, round or PTH.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 82% of the total text.

SMT Far Blind Via to Pad Connection

       Disclosed are methods to provide a good quality solder
joint between blind VIA pad on applique and any pad on the card, for
example, square, rectangle, round or PTH.

      Fig. 1 shows a double hole pad on the applique.  This is a
double-sided pad where the top and bottom are electrically connected
through multiple, plated holes located within pad area.  The presence
of more than one hole allows the operator to see and control the
soldering operation in progress.  Forming of a joint between the
applique and card may be well observed through another hole.  The
cross-section shows the solder joint between double hole pad on the
applique and the pad on the card.

      Fig. 2 shows elongated, slotted hole pad on the applique.  This
is a double-sided pad where the top and bottom are electrically
connected through a plated slotted hole located within the pad area.
The presence of slotted hole allows the operator to see and control
the soldering operation in progress.  Forming of a joint between the
applique and the card may be well observed through the open end of
the slotted hole.  Cross-section shows the solder joint between the
slotted hole pad on applique and the pad on the card.

      Fig. 3 shows a double overlap hole pad on the applique.  This
is a double-sided pad where the top and bottom are electrically
connected through a plated double overlap hole located within the pad
area.  The presence of such...