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Optical Link Card Ground Strip and Electromagnetic Compatibility Shield Attach Process (OEM Product)

IP.com Disclosure Number: IPCOM000110589D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Best, DP: AUTHOR [+4]

Abstract

The equipment and process required for the attachment of ground strips (GS) and electromagnetic compatibility (EMC) shields is disclosed. The equipment shown automatically indexes the GS and EMC shields into printed circuit boards (PCBs).

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This is the abbreviated version, containing approximately 100% of the total text.

Optical Link Card Ground Strip and Electromagnetic Compatibility Shield Attach Process (OEM Product)

       The equipment and process required for the attachment of
ground strips (GS) and electromagnetic compatibility (EMC) shields is
disclosed.  The equipment shown automatically indexes the GS and EMC
shields into printed circuit boards (PCBs).

      The attachment process requires specialized tooling and
fixtures to secure the GS and EMC Shield on PCBs.  The EMC shield and
GS are designed with two compliant pins, each with a lip.  The GS &
EMC shield needs to be securely seated into the PCB to guarantee
proper electrical grounding and to provide electromagnetic
interference (EMI) protection for the PCB.

      The PCB is placed into its respective fixture 1.  These
fixtures 1 precisely locate the assembly such that the top plate 2
can index on the lip of each compliant pin.  The GS and EMC shield
are then secured into the PCB at a specified setting with the
actuator 3.  Adjustments to the fixture along with the lip of each
compliant pin provide proper placement of the GS and EMC shield (see
Figs. 1 and 2).