Browse Prior Art Database

Automatic Contact Free Cleaver

IP.com Disclosure Number: IPCOM000110651D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Harder, C: AUTHOR [+2]

Abstract

In the production of semiconductor laser diodes one of the key fabrication steps is the cleaving of the wafer into bars. Usually this is done by applying pressure on the whole wafer which is placed between two foils. Such a process step involves manual labor and it can damage the wafer and thus decrease yield and impact reliability. The yield of this manual cleaving technique is usually limited by mechanical damage and the reproducibility is rather poor. We propose an automatic contact-free cleaving tool which avoids these problems. The tool consists of two major parts, a support block with a transport groove for the semiconductor wafer and two endless belts to move and cleave the wafer. The transport groove is terminated by a defined wedge.

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Automatic Contact Free Cleaver

       In the production of semiconductor laser diodes one of
the key fabrication steps is the cleaving of the wafer into bars.
Usually this is done by applying pressure on the whole wafer which is
placed between two foils.  Such a process step involves manual labor
and it can damage the wafer and thus decrease yield and impact
reliability.  The yield of this manual cleaving technique is usually
limited by mechanical damage and the reproducibility is rather poor.
We propose an automatic contact-free cleaving tool which avoids these
problems.  The tool consists of two major parts, a support block with
a transport groove for the semiconductor wafer and two endless belts
to move and cleave the wafer.  The transport groove is terminated by
a defined wedge.  The two endless belts are strung on two axes, in an
arrangement very much like the caterpillar tracks on a tank.  These
belts are made out of a soft material (in order not to damage the
wafer on contact) and in order to have enough friction on the wafer,
e.g., Viton O-rings.  This belt arrangement is attached to the
substrate block so that they can be pressed down onto the transport
groove.  The front axle is located around the terminating wedge of
the transport groove.

      The cleaving process is initiated as follows:
1.  The wafer (with scribe marks on one side to initiate cleaving) is
placed into the transport groove on the cleaving tool.  To reduce
friction with the su...