Browse Prior Art Database

Decal Fabrication for Fine Line Transfer to Green Sheets

IP.com Disclosure Number: IPCOM000110667D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 90K

Publishing Venue

IBM

Related People

Chance, DA: AUTHOR [+2]

Abstract

A method for fabricating decals for fine line transfer to green sheets in producing a multi-layer ceramic is disclosed and comprises: coating a carrier layer with a sacrificial layer, an adhesive layer, and a metal film; applying a photoresist to the metal film; etching the metal film to obtain a desired pattern; transferring the etched laminate to a green sheet or laminated stack having metal filled vias; and peeling away the carrier layer prior to firing. By carefully choosing the sacrificial and adhesive layer products required for the provided method, a reliable fine line (approximately 1 mil) transfer process for a decal structure is obtained.

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This is the abbreviated version, containing approximately 52% of the total text.

Decal Fabrication for Fine Line Transfer to Green Sheets

       A method for fabricating decals for fine line transfer to
green sheets in producing a multi-layer ceramic is disclosed and
comprises: coating a carrier layer with a sacrificial layer, an
adhesive layer, and a metal film; applying a photoresist to the metal
film; etching the metal film to obtain a desired pattern;
transferring the etched laminate to a green sheet or laminated stack
having metal filled vias; and peeling away the carrier layer prior to
firing.  By carefully choosing the sacrificial and adhesive layer
products required for the provided method, a reliable fine line
(approximately 1 mil) transfer process for a decal structure is
obtained.

      The basic structure of the decals used in the method is a
carrier layer coated with a sacrificial layer, an adhesive layer and
a metal film.  The carrier layer is typically a flexible film, such
as MYLAR* or KAPTON* of 1 to 5 mils thickness which provides support
for the decal structure during fabrication and transfer.  If desired,
a metal carrier layer may be used where close tolerances are
required.  A thin sacrificial layer comprised of a polyamide blend is
then transferred onto the carrier by dissolving the blend in a heated
alcohol and by dipping or spinning to obtain a thin pore-free coating
of 1 to 2 microns thickness.  A polyamide blend is chosen for the
sacrificial layer as the sacrificial layer must have a low bond
strength with the carrier due to the required peeling step
hereinafter described, and because the sacrificial layer must be
resistant to the solvents used in the adhesive layer which is layered
directly on top of the sacrificial layer.  The adhesive layer is
preferably an acrylic resin-type adhesive consisting of a polymer
blend of acrylonitrile resin for bonding to metal and a phenolic
resin for strength.  The adhesive layer is applied to the sacrificial
layer by spraying, dipping, or spinning,...