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Browse Prior Art Database

Chip to Chip Optical Interconnects using Fused Fiber Plates

IP.com Disclosure Number: IPCOM000110674D
Original Publication Date: 1992-Dec-01
Included in the Prior Art Database: 2005-Mar-25
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

May, PG: AUTHOR [+2]

Abstract

Disclosed is a structure employing fused fiber plates and optical waveguides to provide manufacturable three-dimensional optical interconnects. In addition, the disclosure anticipates the future incorporation of active elements in the structure, thus allowing dynamically reconfigurable optical interconnects.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 64% of the total text.

Chip to Chip Optical Interconnects using Fused Fiber Plates

       Disclosed is a structure employing fused fiber plates and
optical waveguides to provide manufacturable three-dimensional
optical interconnects.  In addition, the disclosure anticipates the
future incorporation of active elements in the structure, thus
allowing dynamically reconfigurable optical interconnects.

      The invention here disclosed consists in combining the advances
made in photolithographic polymer waveguide fabrication with fused
fiber faceplate substrates to form optical integrated circuits which
may be aligned and laminated together to form a three-dimensional
optical interconnection network.  The key features are:
1.  The fiber plates used for vertical optical connections.
2.  The redistribution layers composed of polymer or thin-film
waveguides which provide horizontal optical redistribution and
interconnection.
3.  The mirrors or gratings in the horizontal waveguides used to
redirect the light from vertical to horizontal paths and vice versa.
4.  The polymer or thin-film structures providing vertical waveguide
vias through the redistribution layers.
5.  The nested alignment marks providing accurate optical alignment.
6.  The metallization on the fiber plates allowing direct chip attach
via C4 technology or other surface mount technology, and also
allowing additional electrical shielding for EMC (ElectroMagnetic
Control).
7.  Spatial light modulators or other optical devi...